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Binder-Free Heat Dissipation Films Assembled with Reduced Graphene Oxide and Alumina Nanoparticles for Simultaneously High In-Plane and Cross-Plane Thermal Conductivities
Author
S. Hong, S. S. Yoo and P. J. Yoo*
Journal
Journal of Materials Chemistry C
Page number
7, 9380-9388 [Link]
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